매그나텍

	Current process	Hybrid IMS Process
Tape release(1)
TIM attach on the H/S		SKIP
Tape release(2)		SKIP
Put PCB on the TIM

구분	50	70	90
Min BLT (um)	30 / 70
Thermal conductivity (W/mK)	2
HTC(W/m2K)	4.0E+04	2.9E+04	2.2+E05
Dielectric strength(KVAC/mil)	1.0
Solder resistance(sec@℃)	120 @ 288
Base resin	Silicone (Solvent free)
Dielectric constant	< 9
Filler	Alumina (89wt%)
Color	White
Hardness	Shore A40

<div class="page-wr">
	<h2 class="pr-title"><span class="t-rad"> </span>TIMCCL(IMS with TIM)</h2>
	<div class="tim-ccl-wr">
<div class="timccl-box">
	<div class="tim-ccl-left">
		<div class="tim-ccl-to">
			<p class="title">TIMCCL (IMS with TIM) 핵심기술</p>
			<p>
				· 구조 : IMS와 TIM(Pad)을 일체화 <br>
				· 특징 : 모든 IMS(타사 제품 포함)에 적용
			</p>
		</div>
		<div class="tim-ccl-bo">
			<p class="title">TIMCCL (IMS with TIM) 장점</p>
			<p>
				· Set 조립 공정 단순화 : TIM 공정 skip <br>
				· Air gap(PCB/기구) free : 최소 PCB면 air gap free <br>
				· Solvent free & No Bleeding out <br>
				· TIM 열저항 최소화 : 2W/m-K, 70um <br>
				· Grease 적용이 어려운 부품 조립에 유리, 작은 size, 다수의 hole이 있는 PCB
			</p>
		</div>
	</div>	
	<div class="tim-ccl-right">
		<p><img src="/image/item/timccl-graph.png" alt=""></p>
	</div>
</div>

<div class="ccl-table-wr pcCon">
	<table class="ccl-table table_list">
		<tbody><tr>
			<th> </th>
			<th>Tape release(1)</th>
			<th>TIM attach on the H/S</th>
			<th>Tape release(2)</th>
			<th>Put PCB on the TIM</th>
		</tr>
		<tr>
			<td>Current process</td>
			<td><img src="/image/item/o1.jpg" alt=""></td>
			<td><img src="/image/item/t1.jpg" alt=""></td>
			<td><img src="/image/item/t2.jpg" alt=""></td>
			<td><img src="/image/item/f1.jpg" alt=""></td>
		</tr>
		<tr>
			<td>Hybrid IMS Process</td>
			<td><img src="/image/item/o2.jpg" alt=""></td>
			<td>SKIP</td>
			<td>SKIP</td>
			<td><img src="/image/item/f2.jpg" alt=""></td>
		</tr>
	</tbody></table>
</div>

<div class="ccl-table-wr mobileCon">
	<table class="ccl-table table_list">
	<tbody><tr>
		<th></th>
		<th>Current process</th>
		<th>Hybrid IMS Process</th>
	</tr>
	<tr>
		<th>Tape release(1)</th>
		<td><img src="/image/item/o1.jpg" alt=""></td>
		<td><img src="/image/item/o2.jpg" alt=""></td>
	</tr>
	<tr>
		<th>TIM attach on the H/S</th>
		<td><img src="/image/item/t1.jpg" alt=""></td>
		<td>SKIP</td>
	</tr>
	<tr>
		<th>Tape release(2)</th>
		<td><img src="/image/item/t2.jpg" alt=""></td>
		<td>SKIP</td>
	</tr>
	<tr>
		<th>Put PCB on the TIM</th>
		<td><img src="/image/item/f1.jpg" alt=""></td>
		<td><img src="/image/item/f2.jpg" alt=""></td>
	</tr>
	</tbody></table>
</div>

<div class="ccl-pr-wr">
	<ul>
		<li>
			<p><img src="/image/item/ccl-5.png" alt=""></p>
			<p>TIMCCL Panel</p>
		</li>
		<li>
			<p><img src="/image/item/ccl-2.png" alt=""></p>
			<p>TIMCCL PCB Top View</p>
		</li>
		<li>
			<p><img src="/image/item/ccl-3.png" alt=""></p>
			<p>TIMCCL PCB Bottom View</p>
		</li>
	</ul>
</div>

<table class="timccl-table table_list">
		<tbody><tr>
			<th style="width:40%;">구분</th>
			<th style="width:20%;">50</th>
			<th style="width:20%;">70</th>
			<th style="width:20%;">90</th>
		</tr>
		<tr>
			<td>Min BLT (um)</td>
			<td colspan="3">30 / 70</td>
		</tr>
		<tr>
			<td>Thermal conductivity (W/mK)</td>
			<td colspan="3">2</td>		
		</tr>
		<tr>
			<td>HTC(W/m2K)</td>
			<td>4.0E+04</td>
			<td>2.9E+04</td>
			<td>2.2+E05</td>
		</tr>
		<tr>
			<td>Dielectric strength(KVAC/mil)</td>
			<td colspan="3">1.0</td>
		</tr>
		<tr>
			<td>Solder resistance(sec@℃)</td>
			<td colspan="3">120 @ 288</td>
		</tr>
		<tr>
			<td>Base resin</td>
			<td colspan="3">Silicone (Solvent free)</td>
		</tr>
		<tr>
			<td>Dielectric constant</td>
			<td colspan="3">< 9</td>
		</tr>
		<tr>
			<td>Filler</td>
			<td colspan="3">Alumina (89wt%)</td>
		</tr>
		<tr>
			<td>Color</td>
			<td colspan="3">White</td>
		</tr>
		<tr>
			<td>Hardness</td>
			<td colspan="3">Shore A40</td>
		</tr>
	</tbody></table>

</div>

</div>

</div>" required id="wr_content" placeholder="내용을 입력하세요">

매그나텍

매그나텍

Business

TIMCCL

TIMCCL(IMS with TIM)

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Business

TIMCCL

TIMCCL(IMS with TIM)

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