TIM

본문 바로가기

TIM

TIM (Thermal Interface Material)

핵심기술

    Silicone

  • Solvent free 저점도
  • High filling 가능 : Max 90wt%
  • 분산 및 Filler 응집현상이 없음

    Filler

  • 함량 : 90wt% 충진을 위한 형상, 크기, 조합
  • BLT(Bond Line Thickness) 결정

    High grade TIM

  • 고열전도도, Thin BLT → 열저항 ↓
  • High filling 가능 : Max 90wt%
  • 분산 및 Filler 응집현상이 없음

Silicone

Solvent free
저점도
응집방지

Filler

형상, 함량
크기
조합

TIM

Higher 열전도도
Thin BLT
Bleeding out 최소화
Air gap 최소화
Filler 응집 無

Rth vs. BLT plot

MT-S75-100

Active measurements

BLT [um] Rth [K/W] Rth [K/Wcm2] Average pressure [kPa]
111 1.37 1.77 1
151 1.61 2.07 -1
192 1.84 2.37 0
231 2.06 2.64 -1

Regression

K = 1.37 W/(mK)
Regression equation : 0.7486 + 0.0057 x
R2 = 1.000
O2k = ±0.015 W/(mK)
O2Rth = ±0.006 K/W

MT-A88-32

Active measurements

BLT [um] Rth [K/W] Rth [K/Wcm2] Average pressure [kPa]
31 0.69 0.89 1
71 0.81 1.05 -1
111 0.96 1.24 0
151 1.12 1.44 1
192 1.26 1.62 0
231 1.40 1.80 0

Regression
K = 2.15 W/(mK)

Regression equation : 0.5686 + 0.0036 x
R2 = 0.999
O2k = ±0.032 W/(mK)
O2Rth = ±0.009 K/W

MT-A88-32

Active measurements

BLT [um] Rth [K/W] Rth [K/Wcm2] Average pressure [kPa]
72 0.79 1.01 0
111 0.90 1.15 2
151 1.01 1.30 0
191 1.13 1.45 0
231 1.24 1.59 0

Regression
K = 2.72 W/(mK)

Regression equation : 0.5813 + 0.0029 x
R2 = 1.000
O2k = ±0.019 W/(mK)
O2Rth = ±0.003 K/W